Thursday, April 23
MC: Mike Zhang, CEO, elecfans
10:30-11:00
Improving Wireless Sound with Teledyne LeCroy Audio Expert System（Classic+LE Audio)
Heng Wei, AP Sales Manager, Teledyne LeCory
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11:00-11:30
Channel Sounding and High Data Throughput: The New Pillars of Bluetooth Innovation
Franz Dugand, Product Marketing Senior Director of WIoT BU, Ceva
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11:30-12:00
Advancing Automotive PEPS with Bluetooth Channel Sounding for High Accuracy, Low Latency, and Power Efficient Vehicle Access Systems
Paul Daigle, Senior Product Marketing Manager of Wireless BU, Silicon Labs
Pasi Rahikkala, Senior Systems Engineer, Silicon Labs
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14:00-14:30
Avanced RF Front-End IC and Antenna Technologies for Bluetooth® LE-Based Ultra Low-Power Wireless Connnectivity for AIoT
Dr. Yongxi Qian, Fourder & Chairman, BHW
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14:30-15:00
The New Gateway to AIoT: Innovative Practices of Bluetooth PAN in the Era of Edge AI
Jingming Wang, CEO, SiFli Technologies
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15:00-15:30
A Deep Dive into Bluetooth New Technologies from T&M Perspective
Alice Zhang, BD Manager, Rohde & Schwarz (China) Technology Co. Lt
Friday, April 24
MC: Kevin Cheng, Media Department, XCC
10:30-11:00
Bluetooth and MATLAB: A Winning Combination
Vincent Chen, CES Industry Manager, MathWorks
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11:00-11:30
Multi-Node Bluetooth® LE Channel Sounding: High-Precision Fusion Positioning Based on Phase Ranging
Brandon Chen, Digital Key Product Director, YFORE Technology Co., Ltd.
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11:30-12:00
Bluetooth Communication Topology for Industrial IoT
Zhao Mingzhi, Greater China Market Manager for Consumer, Computing & Communication Business, Infineon
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13:30-16:30
Tech OPC" in the AI Era: Your Guide to Wealth | Turn Smart Solutions into New Income
*Note: The organizer reserves the right to change the schedule; the final schedule shall be subject to the one released on the event day.
